EUROPEANSTANDARD EN 62047-3 NORMEEUROPEENNE EUROPAISCHE NORM September2006 ICS 31.080.99 English version Semiconductor devices - Micro-electromechanical devices Part 3: Thin film standard test piece for tensile testing (IEC62047-3:2006) Dispositifsasemiconducteurs Halbleiterbauelemente Dispositifsmicroélectromécaniques BauteilederMikrosystemtechnik Partie3:Eprouvetted'essai normalisée Teil 3: Dunnschicht-Standardmikroprobe en couche mincepourI'essai de traction fur die Prufung der Zugbeanspruchung (CEI62047-3:2006) (IEC62047-3:2006) This European Standard was approved by CENELEC on 2006-09-01.CENELEC members are bound to comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on application to the Central Secretariat or to any CENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic,Denmark, Estonia, Finland,France,Germany,Greece,Hungary,Iceland, ireland, italy,Latvia. Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Slovenia, Spain, Sweden, Switzerland and the United Kingdom. CENELEC EuropeanCommitteeforElectrotechnical Standardization Comite Européen de Normalisation Electrotechnique EuropaischesKomiteefur ElektrotechnischeNormung CentralSecretariat:ruedeStassart35,B-1050Brussels 2006CENELEC - All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No.EN 62047-3:2006 E - 2 - EN62047-3:2006 Foreword The text of document 47/1866/FDIS, future edition 1 of IEC 62047-3, prepared by IEC TC 47, Semiconductor devices, was submitted to the IEC-CENELEC parallel vote and was approved by CENELEC as EN 62047-3 on 2006-09-01. The following dates were fixed: latest date by which the EN has to be implemented 一 at national level by publication of an identical (dop) national standard orby endorsement 2007-06-01 latest date by which the national standards conflicting with the EN have to be withdrawn (dow) 2009-09-01 AnnexZAhas beenaddedbyCENELEC. Endorsement notice The text of the International Standard IEC 62047-3:2006 was approved byCENELEC as a European Standard without any modification. 3- EN62047-3:2006 CONTENTS Scope.. 2 Normativereferences 3 Testpiecematerials 4 Testpiecefabrications Plane shape of test piece 5 Test piece thickness 6 .5 Gauge mark. 7 8 Test. 9 Documentattachedtostandardtestpieces .6 Annex A(informative)Test piece.. Annex ZA(normative)Normative references to international publications with their correspondingEuropeanpublications... .8 EN62047-3:2006 4- SEMICONDUCTORDEVICES MICRO-ELECTROMECHANICALDEVICES- Part 3: Thin film standard test piece fortensile testing Scope This International Standard specifies a standard test piece, which is used to guarantee the propriety and accuracy of a tensile testing system for thin film materials with length and width under 1 mm and thickness under 10 μm, which are main structural materials for micro- This International Standard is based on such a concept that a tensile testing system can be guaranteed in propriety and accuracy,when the measured tensile strengths of the standard test pieces, whose tensile strength is pre-determined, are within the designated range.It also specifies the test pieces to minimize characteristics deviation among the pieces. 2Normativereferences The following referenced documents are indispensable for the application of this document For dated references, only the edition cited applies. For undated references, th