金融行业标准网
BS EN BRITISH STANDARD 61189-2:2006 Test methods for electrical materials. printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures TheEuropean StandardEN61189-2:2006hasthestatusofa British Standard ICS 31.180 BSi NO COPYING WITHOUT BSI PERMISSION EXCEPT AS PERMITTED BY COPYRIGHT LAW British Standards BSEN61189-2:2006 National foreword This British Standard was published by BSI. It is the UK implementation of EN 61189-2:2006. It is identical with IEC 61189-2:2006. It supersedes BSEN61189-2:1997, which willbewithdrawn 0n1September 2009. The UK participation in its preparation was entrusted to Technical Committee EPL/501, Electronic assembly technology. A list of organizations represented on EPL/501 can be obtained on request to its secretary This publication does not purport to include all the necessary provisions of a contract. Users are responsiblefor its correct application. Compliance with a British Standard cannot confer immunity from legalobligations. This British Standard was Amendmentsissuedsincepublication published under the authority of the Standards Policy and Amd. No. Date Comments Strategy Committee on 30 November 2006 BSI 2006 ISBN0580496503 EUROPEANSTANDARD EN 61189-2 NORME EUROPEENNE EUROPAISCHE NORM September2006 ICS 31.180 Supersedes EN 61189-2:1997 + A1:2000 English version Test methods for electrical materials, printed boards and other interconnection structures and assemblies Part 2: Test methods for materials for interconnection structures (IEC61189-2:2006) Methodesd'essaispourlesmateriaux PrufverfahrenfurElektromaterialien électriques,les cartes imprimees Leiterplatten und andere et autres structures d'interconnexion Verbindungsstrukturen etensembles und Baugruppen Partie 2: Methodes d'essai des materiaux Teil 2: Prufverfahren fur Materialien pourstructures d'interconnexion furVerbindungsstrukturen (CEI61189-2:2006) (IEC61189-2:2006) This European Standard was approved by CENELEC on2006-09-01.CENELEC members areboundto comply with the CEN/CENELEC Internal Regulations which stipulate the conditions for giving this European Standard the status of a national standard without any alteration. Up-to-date lists and bibliographical references concerning such national standards may be obtained on applicationtotheCentralSecretariat orto anyCENELEC member. This European Standard exists in three official versions (English, French, German). A version in any other language made by translation under the responsibility of a CENELEC member into its own language and notified to the Central Secretariat has the same status as the official versions. CENELEC members are the national electrotechnical committees of Austria, Belgium, Cyprus, the Czech Republic, Denmark, Estonia, Finland,France, GermanyGreece, Hungary,'Iceland, ireland, italy,Latvia Lithuania, Luxembourg, Malta, the Netherlands, Norway, Poland, Portugal, Romania, Slovakia, Siovenia, Spain, Sweden, Switzerland and the United Kingdom. CENELEC EuropeanCommitteeforElectrotechnical Standardization Comite Europeen de Normalisation Electrotechnique Europaisches Komiteefur ElektrotechnischeNormung CentralSecretariat: ruedeStassart 35, B-1050Brussels @2006CENELEC- All rights of exploitation in any form and by any means reserved worldwide for CENELEC members. Ref. No.EN 61189-2:2006 E

.pdf文档 IEC 61189-2 2006 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 2 Test methods for materials for interconnection structures

文档预览
中文文档 128 页 50 下载 1000 浏览 0 评论 309 收藏 3.0分
温馨提示:本文档共128页,可预览 3 页,如浏览全部内容或当前文档出现乱码,可开通会员下载原始文档
IEC 61189-2 2006 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 2 Test methods for materials for interconnection structures  第 1 页 IEC 61189-2 2006 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 2 Test methods for materials for interconnection structures  第 2 页 IEC 61189-2 2006 Test methods for electrical materials printed boards and other interconnection structures and assemblies - Part 2 Test methods for materials for interconnection structures  第 3 页
下载文档到电脑,方便使用
本文档由 人生无常 于 2026-01-10 18:03:56上传分享
友情链接
站内资源均来自网友分享或网络收集整理,若无意中侵犯到您的权利,敬请联系我们微信(点击查看客服),我们将及时删除相关资源。