IEC IEC61188-5-4 Edition 1.02007-10 INTERNATIONAL STANDARD Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides IEC 61188-5-4:2007(E) THISPUBLICATIONISCOPYRIGHTPROTECTED Copyright@2007IEC,Geneva,Switzerland either IEC or IEC's member National Committee in the country of the requester. If you have any questions about IEC copyright or have an enquiry about obtaining additional rights to this publication, IEC Central Office 3, rue de Varembe CH-1211 Geneva 20 Switzerland Email: [email protected] Web: www.iec.ch About the IEC The International Electrotechnical Commission (IEC) is the leading global organization that prepares and publishes International Standards for all electrical, electronic and related technologies. About IEC publications The technical content of IEC publications is kept under constant review by the IEC. Please make sure that you have the latest edition, a corrigenda or an amendment might have been published. Catalogue of IEC publications: www.iec.ch/searchpub The IEc on-line Catalogue enables you to search by a variety of criteria (reference number, text, technical committee...). It also gives information on projects, withdrawn and replaced publications. : IEC Just Published: www.iec.ch/online news/justpub Stay up to date on all new IEC publications. Just Published details twice a month all new publications released. Available on-line and also by email. . Electropedia: www.electropedia.org The world's leading online dictionary of electronic and electrical terms containing more than 20 o00 terms and definitions Vocabulary online. -Customer Service Centre:www.iec.ch/webstore/custserv Centre FAQ or contact us: Email: [email protected] Tel.: +4122919 0211 Fax: +4122 919 03 00 IEC IEC 61188-5-4 Edition1.0 2007-10 INTERNATIONAL STANDARD Printed boards and printed board assemblies - Design and use Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides INTERNATIONAL ELECTROTECHNICAL COMMISSION P PRICECODE ICS 31.180 ISBN 2-8318-9341-0 61188-5-4@IEC:2007(E) -2 CONTENTS FOREWORD INTRODUCTION. Scope. 2 Normativereferences 3 Generalinformation. 3.1 General component description ... 6 3.2 Marking. 3.3 Packaging 3.4 Process considerations Small outlinedJpackages (SOJ) 4.1 Component description.. 4.2 Component dimensions . 4.3 Solder joint fillet design ... 9 4.4 Land pattern dimensions. .11 Bibliography.. Figure 1-SoJ construction. 8 Figure2-SoJcomponentdimensions Figure 3 - Solder joint fillet design.. Figure4-SoJ land patterndimensions - 3 - 61188-5-4IEC:2007(E) INTERNATIONALELECTROTECHNICALCOMMISSION PRINTEDBOARDSAND PRINTEDBOARD ASSEMBLIES- DESIGNANDUSE Part 5-4:Attachment (land/joint) considerations- Components withJleadsontwo sides FOREWORD The International Electrotechnical Commission (IEC)is a worldwide organization for standardization comprising 1 all national electrotechnical committees (IEC National Committees). objectof IECistopromote The international co-operation on all questions concerning standardization in the electrical and electronic fields. To Technical Reports, Publicly Available Specifications (PAS) and Guides (hereafter referred to as "TEC Publication(s)"). Their preparation is entrusted to technical committees; any IEC National Committee interested in the subject dealt with may participate in this preparatory work. International, governmental and non- governmental organizations liaising with the IEC also participate in this preparation. .IEC collaborates closely agreementbetweentnetwoorganizations 2) interested IEC National Committees. 3)IEC Publications have the form of recommendations for international use and are accepted by IEC National Committees in that sense. .While all reasonable efforts are made to ensure that the technical content of IEC Publications is accurate, IEC cannot be held responsible for the way in which they are used or for any misinterpretation by any end user.